1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Altera Corp.
65 description: Amarula Solutions
67 description: Amazon.com, Inc.
69 description: Applied Micro Circuits Corporation (APM, formally AMCC)
71 description: Advanced Micro Devices (AMD), Inc.
73 description: Shenzhen Amediatech Technology Co., Ltd
75 description: Amlogic, Inc.
77 description: Ampire Co., Ltd.
81 description: AMS-Taos Inc.
83 description: Analogix Semiconductor, Inc.
85 description: Andes Technology Corporation
87 description: Anvo-Systems Dresden GmbH
89 description: Applied Micro Circuits Corporation (APM)
91 description: Aptina Imaging
93 description: Arasan Chip Systems
95 description: ArcherMind Technology (Nanjing) Co., Ltd.
97 description: Arctic Sand
99 description: arcx Inc. / Archronix Inc.
101 description: Aries Embedded GmbH
103 description: ARM Ltd.
105 description: ARMadeus Systems SARL
107 description: Arrow Electronics
109 description: Artesyn Embedded Technologies Inc.
111 description: Asahi Kasei Corp.
113 description: All Sensors Corporation
115 description: ASPEED Technology Inc.
117 description: AsusTek Computer Inc.
119 description: Atlas Scientific LLC
121 description: Atmel Corporation
123 description: AU Optronics Corporation
125 description: Auvidea GmbH
127 description: Avago Technologies
129 description: avia semiconductor
131 description: Shanghai AVIC Optoelectronics Co., Ltd.
133 description: Avnet, Inc.
135 description: Axentia Technologies AB
137 description: Axis Communications AB
139 description: Azoteq (Pty) Ltd
141 description: Shenzhen AZW Technology Co., Ltd.
143 description: BIPAI KEJI LIMITED
145 description: Beckhoff Automation GmbH & Co. KG
147 description: Bitmain Technologies
149 description: BOE Technology Group Co., Ltd.
151 description: Bosch Sensortec GmbH
153 description: Boundary Devices Inc.
155 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
157 description: Broadcom Corporation
159 description: Buffalo, Inc.
161 description: B&R Industrial Automation GmbH
163 description: Bticino International
165 description: CALAO Systems SAS
169 description: Capella Microsystems, Inc
171 description: Cascoda, Ltd.
173 description: Catalyst Semiconductor, Inc.
175 description: Cavium, Inc.
177 description: Cadence Design Systems Inc.
179 description: CDTech(H.K.) Electronics Limited
181 description: Ceva, Inc.
183 description: Chipidea, Inc
187 description: ChipSPARK
189 description: Common Hardware Reference Platform
191 description: Chunghwa Picture Tubes Ltd.
193 description: Chuwi Innovation Ltd.
195 description: Computadora Industrial Abierta Argentina
197 description: Cirrus Logic, Inc.
199 description: Cloud Engines, Inc.
201 description: Chips&Media, Inc.
203 description: Conexant Systems, Inc.
205 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
207 description: CompuLab Ltd.
209 description: Chengdu Corpro Technology Co., Ltd.
211 description: Cortina Systems, Inc.
213 description: Cosmic Circuits
215 description: Crane Connectivity Solutions
217 description: Creative Technology Ltd
219 description: Crystalfontz America, Inc.
221 description: Hangzhou C-SKY Microsystems Co., Ltd
223 description: Shenzen Chuangsiqi Technology Co.,Ltd.
225 description: Cubietech, Ltd.
227 description: Cypress Semiconductor Corporation
229 description: CZ.NIC, z.s.p.o.
231 description: Maxim Integrated Products (formerly Dallas Semiconductor)
233 description: DataImage, Inc.
235 description: DAVICOM Semiconductor, Inc.
237 description: Delta Electronics, Inc.
239 description: Denx Software Engineering
241 description: Devantech, Ltd.
243 description: DH electronics GmbH
245 description: Shenzhen Yagu Electronic Technology Co., Ltd.
247 description: Digi International Inc.
249 description: Diglent, Inc.
251 description: Dioo Microcircuit Co., Ltd
253 description: DLC Display Co., Ltd.
255 description: Dialog Semiconductor
257 description: D-Link Corporation
259 description: Data Modul AG
261 description: Domintech Co., Ltd.
263 description: Dongwoon Anatech
265 description: DPTechnics
267 description: Dragino Technology Co., Limited
269 description: dServe Technology B.V.
271 description: Embedded Artists AB
273 description: EBS-SYSTART GmbH
275 description: EBV Elektronik
277 description: Eckelmann AG
279 description: Emerging Display Technologies
281 description: eGalax_eMPIA Technology Inc
283 description: Einfochips
285 description: Elan Microelectronic Corp.
287 description: Elgin S/A.
289 description: Shenzhen Embest Technology Co., Ltd.
291 description: Emlid, Ltd.
293 description: EM Microelectronic
294 "^empire-electronix,.*":
295 description: Empire Electronix
297 description: emtrion GmbH
299 description: Endless Mobile, Inc.
301 description: Silicon Laboratories (formerly Energy Micro AS)
303 description: Engicam S.r.l.
305 description: EPCOS AG
307 description: Ecole Polytechnique Fédérale de Lausanne
309 description: Seiko Epson Corp.
311 description: Espressif Systems Co. Ltd.
313 description: ESTeem Wireless Modems
315 description: NI Ettus Research
317 description: Eukréa Electromatique
319 description: Everest Semiconductor Co. Ltd.
321 description: Everspin Technologies, Inc.
323 description: Evervision Electronics Co. Ltd.
325 description: Exar Corporation
329 description: EZchip Semiconductor
331 description: Facebook
333 description: Fairphone B.V.
335 description: Faraday Technology Corporation
337 description: Fastrax Oy
339 description: Fairchild Semiconductor
341 description: Shenzhen Fly Young Technology Co.,LTD.
345 description: FocalTech Systems Co.,Ltd
347 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
349 description: Freescale Semiconductor
351 description: Fujitsu Ltd.
353 description: GARDENA GmbH
355 description: Gateworks Corporation
357 description: Game Consoles Worldwide
359 description: General Electric Company
361 description: GeekBuying
363 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
365 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
367 description: Gemei Digital Technology Co., Ltd.
369 description: Geniatech, Inc.
371 description: Giantec Semiconductor, Inc.
373 description: Giantplus Technology Co., Ltd.
375 description: Globalscale Technologies, Inc.
377 description: GlobalTop Technology, Inc.
379 description: Global Mixed-mode Technology, Inc.
381 description: Shenzhen Huiding Technology Co., Ltd.
383 description: Google, Inc.
387 description: Garmin Limited
389 description: Gumstix, Inc.
391 description: Gateworks Corporation
393 description: HannStar Display Corporation
395 description: Haoyu Microelectronic Co. Ltd.
397 description: Hardkernel Co., Ltd
399 description: HiDeep Inc.
401 description: Himax Technologies, Inc.
403 description: Hisilicon Limited.
405 description: Hitachi Ltd.
407 description: Hitex Development Tools
409 description: Holt Integrated Circuits, Inc.
411 description: Honeywell
413 description: Jiangsu HopeRun Software Co., Ltd.
415 description: Hewlett Packard
417 description: HannStar Display Co.
419 description: Holtek Semiconductor, Inc.
421 description: Shenzhen Hugsun Technology Co. Ltd.
423 description: HwaCom Systems Inc.
425 description: Hyundai Technology
427 description: I2SE GmbH
429 description: International Business Machines (IBM)
431 description: IC Plus Corp.
433 description: Integrated Device Technologies, Inc.
435 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
437 description: ILI Technology Corporation (ILITEK)
439 description: Imagination Technologies Ltd.
441 description: In-Circuit GmbH
443 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
445 description: Infineon Technologies
447 description: Inforce Computing
449 description: Ingenic Semiconductor
451 description: Innolux Corporation
453 description: INSIDE Secure
455 description: Inspur Corporation
457 description: Intel Corporation
459 description: Inter Control Group
461 description: InvenSense Inc.
463 description: Inverse Path
465 description: Iomega Corporation
467 description: ISEE 2007 S.L.
469 description: Intersil
471 description: Integrated Silicon Solutions Inc.
473 description: ITEAD Intelligent Systems Co.Ltd
475 description: iWave Systems Technologies Pvt. Ltd.
477 description: Japan Display Inc.
479 description: JEDEC Solid State Technology Association
481 description: Shenzhen Jesurun Electronics Business Dept.
483 description: Jiandangjing Technology Co., Ltd.
485 description: Kamstrup A/S
487 description: Ka-Ro electronics GmbH
489 description: Keith & Koep GmbH
491 description: Keymile GmbH
495 description: Kieback & Peter GmbH
497 description: Kinetic Technologies
499 description: King & Display Technology Co., Ltd.
501 description: Kingnovel Technology Co., Ltd.
503 description: Kionix, Inc.
505 description: Rakuten Kobo Inc.
507 description: Kaohsiung Opto-Electronics Inc.
509 description: Kontron S&T AG
511 description: Sutajio Ko-Usagi PTE Ltd.
513 description: Kyocera Corporation
517 description: Laird PLC
519 description: Ketai Huajie Technology Co., Ltd.
521 description: Lantiq Semiconductor
523 description: Lattice Semiconductor
525 description: Shenzhen Leadtek Technology Co., Ltd.
529 description: LEGO Systems A/S
531 description: Shenzhen LeMaker Technology Co., Ltd.
533 description: Lenovo Group Ltd.
535 description: LG Corporation
537 description: LG Display
539 description: Shenzhen Libre Technology Co., Ltd
541 description: Lichee Pi
543 description: Linaro Limited
545 description: LinkSprite Technologies, Inc.
547 description: Belkin International, Inc. (Linksys)
549 description: Linux-specific binding
551 description: Linx Technologies
553 description: Linear Technology Corporation
555 description: Logic PD, Inc.
557 description: Longcheer Technology (Shanghai) Co., Ltd.
559 description: LSI Corp. (LSI Logic)
561 description: Liebherr-Werk Nenzing GmbH
563 description: Macnica Americas
565 description: Mapleboard.org
567 description: Marvell Technology Group Ltd.
569 description: MaxBotix Inc.
571 description: Maxim Integrated Products
573 description: Mobiveil Inc.
577 description: Measurement Specialties
579 description: Mustek Limited
581 description: MediaTek Inc.
583 description: MegaChips
585 description: Shenzhen MeLE Digital Technology Ltd.
587 description: Melexis N.V.
589 description: MELFAS Inc.
591 description: Mellanox Technologies
593 description: MEMSIC Inc.
595 description: Menlo Systems GmbH
597 description: Merrii Technology Co., Ltd.
599 description: Micrel Inc.
601 description: Microchip Technology Inc.
603 description: Micro Crystal AG
605 description: Micron Technology Inc.
607 description: Microsoft Corporation
609 description: MikroElektronika d.o.o.
611 description: Miniand Tech
613 description: MINIX Technology Ltd.
615 description: MiraMEMS Sensing Technology Co., Ltd.
617 description: Mitsubishi Electric Corporation
619 description: Mosaix Technologies, Inc.
621 description: Motorola, Inc.
623 description: Moxa Inc.
627 description: Monolithic Power Systems Inc.
629 description: mqmaker Inc.
631 description: Microsemi Corporation
633 description: Micro-Star International Co. Ltd.
635 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
637 description: Multi-Inno Technology Co.,Ltd
639 description: Mundo Reader S.L.
641 description: Murata Manufacturing Co., Ltd.
643 description: Macronix International Co., Ltd.
645 description: MYIR Tech Limited
647 description: National Semiconductor
649 description: NEC LCD Technologies, Ltd.
651 description: Neonode Inc.
655 description: Broadcom Corporation (formerly NetLogic Microsystems)
657 description: Netron DY
659 description: Shenzhen Netxeon Technology CO., LTD
663 description: Next Thing Co.
665 description: Newhaven Display International
667 description: National Instruments
669 description: Nintendo
671 description: NLT Technologies, Ltd.
675 description: Nordic Semiconductor
677 description: NovTech, Inc.
679 description: NutsBoard
681 description: Nuvoton Technology Corporation
683 description: New Vision Display
687 description: NXP Semiconductors
689 description: Oceanic Systems (UK) Ltd.
691 description: Okaya Electric America, Inc.
693 description: Oki Electric Industry Co., Ltd.
695 description: OLIMEX Ltd.
697 description: One Laptop Per Child
699 description: Onion Corporation
701 description: ON Semiconductor Corp.
703 description: On Tat Industrial Company
705 description: Opal Kelly Incorporated
707 description: OpenCores.org
709 description: OpenRISC.io
711 description: Option NV
713 description: Shenzhen Oranth Technology Co., Ltd.
715 description: Oracle Corporation
717 description: Orise Technology
719 description: Ortus Technology Co., Ltd.
721 description: OSD Displays
723 description: Overkiz SAS
725 description: OmniVision Technologies
727 description: Oxford Semiconductor, Ltd.
729 description: Panasonic Corporation
731 description: Parade Technologies Inc.
733 description: Parallax Inc.
735 description: Precision Design Associates, Inc.
737 description: Pericom Technology Inc.
739 description: Pervasive Displays, Inc.
741 description: PHICOMM Co., Ltd.
743 description: PHYTEC Messtechnik GmbH
745 description: Picochip Ltd
749 description: Shenzhen PineRiver Designs Co., Ltd.
751 description: PIXCIR MICROELECTRONICS Co., Ltd
753 description: Plantower Co., Ltd
755 description: Plat\'Home Co., Ltd.
759 description: Broadcom Corporation (formerly PLX Technology)
761 description: PNI Sensor Corporation
763 description: Polaroid Corporation
765 description: Portwell Inc.
767 description: Poslab Technology Co., Ltd.
769 description: Point of View International B.V.
771 description: PowerVR (deprecated, use img)
773 description: Primux Trading, S.L.
775 description: PROBOX2 (by W2COMP Co., Ltd.)
777 description: PulsedLight, Inc
779 description: Purism, SPC
781 description: Qualcomm Atheros, Inc.
783 description: Qualcomm Technologies, Inc
785 description: QEMU, a generic and open source machine emulator and virtualizer
787 description: Qi Hardware
789 description: Chengdu Kaixuan Information Technology Co., Ltd.
791 description: QiaoDian XianShi Corporation
793 description: QNAP Systems, Inc.
797 description: RaidSonic Technology GmbH
799 description: Mediatek/Ralink Technology Corp.
801 description: Ramtron International
803 description: Raspberry Pi Foundation
805 description: Raydium Semiconductor Corp.
807 description: Unisoc Communications, Inc.
809 description: Realtek Semiconductor Corp.
811 description: Renesas Electronics Corporation
813 description: Shenzhen Rervision Technology Co., Ltd.
815 description: Richtek Technology Corporation
817 description: Ricoh Co. Ltd.
819 description: Rikomagic Tech Corp. Ltd
821 description: RISC-V Foundation
823 description: Fuzhou Rockchip Electronics Co., Ltd
825 description: ROCKTECH DISPLAYS LIMITED
827 description: ROHM Semiconductor Co., Ltd
829 description: Ronbo Electronics
831 description: Shenzhen Roofull Technology Co, Ltd
833 description: Samsung Semiconductor
835 description: Samtec/Softing company
837 description: Sancloud Ltd
839 description: Sandisk Corporation
841 description: Satoz International Co., Ltd
843 description: Smart Battery System
845 description: Schindler
847 description: Seagate Technology PLC
849 description: Shenzhen SEI Robotics Co., Ltd
851 description: Semtech Corporation
853 description: Sensirion AG
855 description: Sensortek Technology Corporation
857 description: Small Form Factor Committee
859 description: Solomon Goldentek Display Corporation
861 description: SGX Sensortech
863 description: Sharp Corporation
865 description: Shimafuji Electric, Inc.
867 description: Si-En Technology Ltd.
869 description: Silicon Linux Corporation
871 description: SiFive, Inc.
873 description: Sigma Designs, Inc.
875 description: Seiko Instruments, Inc.
877 description: Silicon Image
879 description: Silicon Laboratories
881 description: Silead Inc.
883 description: Silergy Corp.
885 description: Silicon Mitus, Inc.
887 description: Cypress Semiconductor Corporation (Simtek Corporation)
889 description: Sinlinx Electronics Technology Co., LTD
891 description: SinoVoip Co., Ltd
893 description: Shenzhen Sipeed Technology Co., Ltd.
895 description: SiRF Technology, Inc.
897 description: Silicon Integrated Systems Corp.
899 description: Sitronix Technology Corporation
901 description: Skyworks Solutions, Inc.
903 description: Standard Microsystems Corporation
905 description: Synopsys, Inc.
907 description: Shenzhen SoChip Technology Co., Ltd.
909 description: Socionext Inc.
911 description: SolidRun
913 description: Solomon Systech Limited
915 description: Sony Corporation
917 description: Spansion Inc.
919 description: Spreadtrum Communications Inc.
921 description: Silicon Storage Technology, Inc.
923 description: STMicroelectronics
925 description: Starry Electronic Technology (ShenZhen) Co., LTD
929 description: ST-Ericsson
932 description: ST-Ericsson
934 description: ST-Ericsson
937 description: Summit microelectronics
939 description: Shenzhen Sunchip Technology Co., Ltd
941 description: Sun Microsystems, Inc
943 description: Sierra Wireless
945 description: Synaptics Inc.
947 description: Synology, Inc.
949 description: TBS Technologies
950 "^tbs-biometrics,.*":
951 description: Touchless Biometric Systems AG
953 description: Trusted Computing Group
955 description: Toby Churchill Ltd.
957 description: TechNexion
959 description: Technologic Systems
961 description: Tempo Semiconductor
963 description: Shenzhen Techstar Electronics Co., Ltd.
965 description: Terasic Inc.
967 description: Three Five Corp
969 description: THine Electronics, Inc.
971 description: Texas Instruments
973 description: Tianma Micro-electronics Co., Ltd.
975 description: Trusted Logic Mobility
977 description: Tecon Microprocessor Technologies, LLC.
981 description: TPO (deprecated, use tpo)
984 description: Toradex AG
986 description: Toshiba Corporation
990 description: TPK U.S.A. LLC
992 description: TP-LINK Technologies Co., Ltd.
996 description: TQ Systems GmbH
1000 description: Tronsmart
1002 description: Truly Semiconductors Limited
1004 description: Theobroma Systems Design und Consulting GmbH
1006 description: Tyan Computer Corporation
1010 description: uCRobotics
1012 description: Ubiquiti Networks
1016 description: Ugoos Industrial Co., Ltd.
1018 description: United Western Technologies Corp (UniWest)
1020 description: uPI Semiconductor Corp.
1022 description: United Radiant Technology Corporation
1024 description: Universal Scientific Industrial Co., Ltd.
1026 description: Aigo Digital Technology Co., Ltd.
1028 description: V3 Semiconductor
1030 description: Vamrs Ltd.
1032 description: Variscite Ltd.
1034 description: VIA Technologies, Inc.
1036 description: Virtual I/O Device Specification, developed by the OASIS consortium
1038 description: Vishay Intertechnology, Inc
1040 description: Vitesse Semiconductor Corporation
1042 description: Vivante Corporation
1044 description: VoCore Studio
1046 description: Voipac Technologies s.r.o.
1048 description: Vision Optical Technology Co., Ltd.
1050 description: VXT Ltd
1052 description: Western Digital Corp.
1054 description: WeTek Electronics, limited.
1058 description: Shenzhen whwave Electronics, Inc.
1060 description: Wi2Wi, Inc.
1062 description: Winbond Electronics corp.
1064 description: Winstar Display Corp.
1066 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1068 description: Wolfson Microelectronics
1070 description: Wondermedia Technologies, Inc.
1074 description: X-Powers
1076 description: Extreme Engineering Solutions (X-ES)
1078 description: Xillybus Ltd.
1080 description: Shenzhen Xinpeng Technology Co., Ltd
1084 description: Shenzhen Xunlong Software CO.,Limited
1087 "^yones-toptech,.*":
1088 description: Yones Toptech Co., Ltd.
1090 description: Y Soft Corporation a.s.
1092 description: Zarlink Semiconductor
1094 description: ZEITEC Semiconductor Co., LTD.
1096 description: Shenzhen Zidoo Technology Co., Ltd.
1098 description: Zodiac Inflight Innovations
1100 description: ZTE Corp.
1102 description: ZyXEL Communications Corp.
1104 # Normal property name match without a comma
1105 # These should catch all node/property names without a prefix
1106 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1107 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1110 additionalProperties: false