perf/x86/intel/rapl: Support multi-die/package

perf/x86/intel/rapl: Support multi-die/package

RAPL becomes die-scope on Xeon Cascade Lake-AP. Perf RAPL driver needs to
support die-scope RAPL domain.

Use topology_logical_die_id() to replace topology_logical_package_id().
For previous platforms which doesn't have multi-die,
topology_logical_die_id() is identical as topology_logical_package_id().

Use topology_die_cpumask() to replace topology_core_cpumask().  For
previous platforms which doesn't have multi-die, topology_die_cpumask() is
identical as topology_core_cpumask().

There is no functional change for previous platforms.

Signed-off-by: Kan Liang <kan.liang@linux.intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/851320c8c87ba7a54e58ee8579c1bf566ce23cbb.1557769318.git.len.brown@intel.com